Organised by MMI Messe München International, electronica and productronica India 2009, the leading trade fair for electronics in India and South Asia, was held at the Bangalore International Exhibition Centre from September 8 to 11, 2009. Lamineries MATTHEY SA, in partnership with its Indian representative MRK Engineers Pvt. Ltd., was one of 825 direct exhibitors. “We are very pleased with the result. Over 10’000 visitors made their way to the Show and we had a large number of very promising new customer discussions” said Francis Thiébaud, Lamineries MATTHEY’s V.P. Sales and Marketing. “It was also encouraging to see many of our existing Indian customers take time to visit our booth” he added.

In addition to applications made from strip alloys traditionally in its product line-up, Lamineries MATTHEY exhibited many new products such as Mumetall strip for shielding applications, recently introduced nickel alloys including 718, alloy X or alloy 750 as well as titanium, cobalt-chromium and specialty stainless steels in the form of rod and wire for medical applications.

Among the specialities re-rolled by Lamineries MATTHEY is the new alloy ToughMet® 3.

ToughMet®  3 was developed by Brush Wellman on the basis of a patented rapid-solidification process called EquaCast®. It is a copper-based alloy containing nickel and tin and demonstrates a series of exceptional properties. Besides classic applications such as bearings, interesting uses for ToughMet® 3 can also be found in the form of thin rolled precision strips, where mechanical strength, corrosion resistance and stress relaxation resistance are of primary importance. After the forming process, the manufactured parts can can be hardened by an appropriate heat treatment. Even the most complex parts will remain practically distortion free after hardening. This exceptional behaviour is a result of the metallurgical hardening mechanism - the so-called spinodal decomposition.

Lamineries MATTHEY offers ToughMet® 3 strips for applications such as connectors and watch making.

Please refer to the new technical datasheet.